REDMAGIC Cooling Technology: The World's First Active Liquid Cooling Tech

001 Evolution

From Passive to Active to Flowing Liquid.

Cooling innovation at REDMAGIC has always been about breaking boundaries to elevate the gaming experience. While we used passive cooling in 2018, we knew that we were looking for more.
In 2019, we dared to do what no one else had tried: we built the world’s first internal turbofan inside a smartphone. This was the beginning of our active cooling journey. From air-cooling and massive vapor chambers to Liquid Metal, we have relentlessly chased the ultimate thermal equilibrium.
Today, with the REDMAGIC 11 Pro, we introduce the AquaCore Cooling System. For the first time, active flowing liquid cooling meets aerospace-grade mechanics, creating a level of heat dissipation never before seen in a smartphone.

2025.11

REDMAGIC 11 Pro

AquaCore System introduces the first mass-produced flowing liquid cooling + Liquid Metal 3.0.

2024.12

REDMAGIC 10 Series

Introduction of our composite Liquid Metal.

2023.12

REDMAGIC 9 Series

10,000mm² class VC + 22,000 RPM fan.

2021.03

REDMAGIC 6 Series

Introduction of the VC (Vapor Chamber) replacing pipes + Phase Change Material (PCM).

2019.04

REDMAGIC 3 Series

Industry’s first built-in 14,000 RPM centrifugal fan + liquid cooling pipe design.

2018.04

REDMAGIC

The era of passive cooling using air convection + graphite.

The AquaCore cooling system

The AquaCore cooling system ensures extreme heat dissipation through a complete three-stage process.

01.

Absorption

In the heat absorption and conduction stage, the system uses Composite Liquid Metal 3.0 as a medium to instantly transfer heat from the core processor to the cooling structure.

01

02.

Heat Equalization

In the heat spreading stage, AquaCore employs AI server-grade fluorinated liquid circulation and the industry’s largest 13,116 mm² 3D VC heat spreader to distribute heat in a three-dimensional, dynamic, and highly efficient manner.

02

03.

Dissipation

Finally, in the heat exhaust stage, a waterproof turbo fan spinning up to 24,000 RPM generates powerful airflow, working with high-speed aerospace aluminum ducts to completely expel heat from the device, ensuring sustained peak performance under any extreme gaming load.

03

002 Cooling System

AquaCore Liquid-Cooling System Heat Dissipation Process

Absorption -The First Mile: Extracting Heat From the Core.

Core Material

Non-corrosive, ultra-conductive composite Liquid Metal 3.0. Placed directly between the SoC and the VC with thermally conductive gel and under-screen copper foil.

Under-screen Copper Foil

Rapidly conducts and disperses heat, effectively preventing thermal accumulation on the motherboard to ensure sustained peak performance.

The Path to Liquid Metal

Liquid Metal

Gen 1 (REDMAGIC 1-5)

Standard thermal gel + Graphite.

Gen 2 (REDMAGIC 5S)

ICE Ag (Silver Plate) added for faster conduction.

Gen 3 (REDMAGIC 9S)

Frost cooling gel for 20% better efficiency.

Gen 4 (REDMAGIC 10/11)

Liquid Metal evolved from solid pads to semi-solid liquid metal for seamless thermal transference.

The Expansion: Spreading Heat Across the Surface.

Flowing Liquid Cooling

AI server-grade fluorinated liquid circulates to actively move heat, not just spread it.

3D Vapor Chamber

A 13,116 mm² 3D Vapor Chamber with a double-sided raised design ensures 50% better heat dissipation.

From Design to Flow

Flow

Stage 1 (REDMAGIC 3)

Liquid cooling copper tube pipe for linear heat transfer.

Stage 2 (REDMAGIC 6)

VC heat Sink for planar (2D) heat transfer.

Stage 3 (REDMAGIC 8/9）

3D step VC for increased volume and surface area (10,182mm²).

Stage 4 (REDMAGIC 11)

Flowing liquid cooling moving from static conduction to active circulation.

The Release: Ejecting Heat Into the Air.

24,000 RPM Waterproof Turbo Fan

The industry's fastest fan, built with shark-fin blades and a high-speed aerospace aluminum air duct, along with an IPX8 waterproof rating to ensure airflow, even in damp conditions.

Aerospace-Grade Aluminum Air Duct

Designed for high-velocity airflow, this precision duct targets core heat zones with zero dead angles, efficiently channeling heat directly to the exhaust outlet.

Fanning the Flames

Turbo Fan

v1.0 (REDMAGIC 3)

14,000 RPM fan with an IP55 rating.

v2.0 (REDMAGIC 5/6)

18,000 - 20,000 RPM fan with a metal cover to reduce noise.

v3.0 (REDMAGIC 9)

Shark fin vortex design for increased air pressure and reduced noise.

v4.0 (REDMAGIC 11)

24,000 RPM fan + waterproofing for the ultimate aerodynamic engine.

003 Experience

Freeze the Lag. Fuel the Victory. Icy tech for a fire experience.

The AquaCore cooling system delivers more than just looks—it brings a lasting, cool touch at your fingertips. It achieves comprehensive temperature control from the core to the surface, letting you say goodbye to overheating and enjoy peak performance without limits.

Zero Throttling

The powerful AquaCore cooling system efficiently manages heat, allowing the Snapdragon 8 Elite Gen 5 processor to completely overcome throttling, maintain sustained peak frequencies, and deliver a top-tier, lag-free and smooth gaming experience throughout your sessions.

Comfortable Grip

By efficiently moving heat away from the frame and screen using under-display graphene and a 3D VC, your hands stay cool even after hours of intense gaming.

Silent Power

Despite the record-breaking 24,000 RPM speed, our shark fin blade fan operates at a whisper-quiet 4dB, keeping you immersed in the game without the noise.

ARCTIC ENGINEERING. THE FIRST OF ITS KIND.